LED lamp bead structure fully resolved

LED lamp bead mainly consists of bracket, silver glue, wafer, gold wire, epoxy resin five materials.

1. LED lamp bead support

1. Functions of the bracket: conducting electricity and supporting

2. Composition of the bracket: the bracket is formed by electroplating the bracket material, which is composed of five layers of material, copper, nickel, copper and silver from inside to outside.

3. Type of bracket: spotlight type with cup bracket, large Angle astigmatism type with flat head bracket.

Two, LED lamp bead silver glue

1. The role of silver glue: fixing the chip and conducting electricity.

2. Main ingredients of silver glue: silver powder accounts for 75-80%, EPOXY(EPOXY) account for 10-15%, additives account for 5-10%. Official account: Shenzhen LED network

3. Use of silver glue: refrigerate, defrost and stir evenly before use, because silver glue will precipitate after a long time, if not stir evenly will affect the performance of silver glue.

LED lamp bead chip

1. Function of chip: Chip is the main component material of LED Lamp, and is the semiconductor material of luminescence.

2. Composition of the wafer: the wafer is composed of gallium phosphide (GaP), gallium aluminum arsenic (GaAlAs) or gallium arsenide (GaAs), gallium nitride (GaN) and other materials, and its internal structure has one-way conductivity.

3. Wafer structure: welded single wire normal polarity (P/N structure) wafer, double wire wafer. A unit of size for a wafer: mIL. The solder pad is usually gold or aluminum. The shape of the pad is round, square, cross and so on.

4. Chip luminous color: Chip luminous color depends on wavelength, common visible light can be roughly classified as: Dark red (700nm), dark red (640-660nm), red (615-635nm), amber (600-610nm), yellow (580-595nm), yellow-green (565-575nm), pure green (500-540nm), blue (450-480nm), purple (380-) 430 nm). Official account: Shenzhen LED network

White and pink light is a mixture of light. The most common is a mixture of blue + yellow phosphors and blue + red phosphors.

5. Main technical parameters of the chip:

A. Voltammetric characteristic diagram of the chip;

B. Forward voltage (VF) : voltage applied to both ends of the chip so that the chip is on. This voltage is related to the chip itself and the test current. VF is too large, the chip will be broken down.

C. Forward current (IF) : the positive guiding current generated by the chip after applying a certain voltage. The magnitude of IF depends on the magnitude of the forward voltage. The operating current of the chip is around 10-20mA.

D. Reverse voltage (VR) : reverse voltage applied to the chip. Official account: Shenzhen LED network

E. Reverse current (IR) : refers to a leakage current generated by applying reverse voltage to the chip. The smaller the current, the better. Because the current is high easy to cause the chip reverse breakdown.

F. Brightness (IV) : refers to the brightness of the light source. Unit conversion: 1cd=1000mcd

G. Wavelength: reflects the light color of the chip. Different wavelengths of chips glow in different colors. Unit: nm

Four, LED lamp bead gold wire

1. The role of gold wire: connect the chip PAD(welding PAD) with the support, and enable it to conduct.

The purity of gold thread is 99.99%Au. The elongation is 2-6%, and the size of gold wire is 0.9mil, 1.0mil, 1.1mil, etc.

Five, LED lamp beads epoxy resin

1. Function of epoxy resin: protect the internal structure of Lamp, and slightly change Lamp light color, brightness and Angle; Shape Lamp.

2. Packaging resin includes: A glue (main agent), B glue (hardener), DP(diffusion agent), CP(colorant) four parts. Its main components are Epoxy Resin, Anhydride, Light diffusion and thermal stability dye.

For more products please click: Customized Led strip light